Invention Grant
- Patent Title: Multilayer coil component
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Application No.: US16881526Application Date: 2020-05-22
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Publication No.: US11646144B2Publication Date: 2023-05-09
- Inventor: Atsuo Hirukawa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP 2019097639 2019.05.24
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F17/00

Abstract:
A multilayer coil component includes a multilayer body, and first and second outer electrodes. The multilayer body is formed by stacking plural insulating layers in a length direction, and includes a coil incorporated therein. The first and second outer electrodes are electrically connected to the coil. The coil is formed by electrically connecting plural coil conductors. The multilayer body has first and second end surfaces, first and second major surfaces, and first and second lateral surfaces. Each coil conductor has a line portion, and a land portion. As viewed in plan in the stacking direction, the land portion is not located inside the inner periphery of the line portion, and partially overlaps the line portion. As viewed in plan in the stacking direction, the land portion has a diameter of from about 1.05 times to about 1.3 times the line width of the line portion.
Public/Granted literature
- US20200373054A1 MULTILAYER COIL COMPONENT Public/Granted day:2020-11-26
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