A low-profile high minimum creepage housing for electronic components such as transformers is provided. The housing can include a body and a lid. The lid can have attachment members that secure the lid to the body, after an electronic component is installed into the body. The attachment members of the lid may also secure a wire routed along the outside of the body against the body. The lid may include protruding portions that extend into the body, thereby elongating a minimum creepage path.