Invention Grant
- Patent Title: Coil component
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Application No.: US16879025Application Date: 2020-05-20
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Publication No.: US11646146B2Publication Date: 2023-05-09
- Inventor: Young Il Lee , Jeong Gu Yeo , Ji Hoon Hwang , Myoung Ki Shin , Byeong Cheol Moon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20190163946 2019.12.10
- Main IPC: H01F27/255
- IPC: H01F27/255 ; H01F17/00 ; H01F27/28 ; H01F27/32

Abstract:
A coil component includes a body comprising a support member and a coil portion embedded in one surface of the support member; and external electrodes connected to the coil portion, wherein the body comprises a plurality of metal particles, at least some of the plurality of metal particles comprises a plastically deformable first particle, and at least some of the first particles have a deformed surface and thus have a shape corresponding to a surface of a neighboring magnetic metal particle.
Public/Granted literature
- US20210175001A1 COIL COMPONENT Public/Granted day:2021-06-10
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