Invention Grant
- Patent Title: Structure of magnetic inductive coil module
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Application No.: US16792273Application Date: 2020-02-16
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Publication No.: US11646149B2Publication Date: 2023-05-09
- Inventor: Chih-Hung Lin , Kun-Chuan Chang
- Applicant: Chih-Hung Lin , Kun-Chuan Chang
- Applicant Address: TW New Taipei
- Assignee: PIN SHINE INDUSTRIAL CO., LTD.
- Current Assignee: PIN SHINE INDUSTRIAL CO., LTD.
- Current Assignee Address: TW New Taipei
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/06 ; H01F27/24

Abstract:
A coil module includes a first coil set; a second coil set, including a first coil body, a second coil body and an insulative separator disposed between the first coil body and the second coil body, the separator having an adopting hole, the first coil body having an open winding surrounding the adapting hole and fixed on a side of the separator, the second coil body having an open winding surrounding the adapting hole and fixed on another side of the separator; and a coil base sheathing the second coil set with exposing the adopting hole. The first coil set surrounds the adopting hole and is fixed on the coil base to form a coil module.
Public/Granted literature
- US20210225579A1 Structure of Magnetic Inductive Coil Module Public/Granted day:2021-07-22
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