An electronic component includes an element body including a side surface and an end surface adjacent to each other, and an external electrode disposed on the side surface and the end surface. The external electrode includes a metal layer disposed on the side surface and the end surface and made of sintered copper, a conductive resin layer that is disposed on the metal layer in such a manner that a partial region of the metal layer is exposed and contains a plurality of copper particles and a resin, and a plating layer disposed on the partial region of the metal layer and the conductive resin layer. The conductive resin includes a first portion located on the side surface. The plating layer includes a second portion located on the side surface. A thickness of the first portion is smaller than a thickness of the second portion.