Invention Grant
- Patent Title: Substrate support assembly with arc resistant coolant conduit
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Application No.: US16825466Application Date: 2020-03-20
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Publication No.: US11646183B2Publication Date: 2023-05-09
- Inventor: Stephen Donald Prouty , Alvaro Garcia De Gorordo , Andreas Schmid , Andrew Antoine Noujaim
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/67 ; H01L21/683

Abstract:
Semiconductor chamber components are described herein that includes one or more conduits for carrying a fluid between powered and grounded portions of the chamber component, the conduit configure to be less prone to arcing as compared to conventional components. In one example, a semiconductor chamber component is provided that includes a powered region, a grounded region, and a fluid conduit. The fluid conduit is disposed within the semiconductor chamber component and passes through the powered and grounded regions. The fluid conduit has an end to end electrical resistance of between 0.1 to 100 MΩ.
Public/Granted literature
- US20210296101A1 SUBSTRATE SUPPORT ASSEMBLY WITH ARC RESISTANT COOLANT CONDUIT Public/Granted day:2021-09-23
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