Invention Grant
- Patent Title: Method of cleaning wafer and wafer with reduced impurities
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Application No.: US17477866Application Date: 2021-09-17
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Publication No.: US11646209B2Publication Date: 2023-05-09
- Inventor: Jong Hwi Park , Il Hwan Yoo , Kap-Ryeol Ku , Jung-Gyu Kim , Jung Woo Choi , Eun Su Yang , Byung Kyu Jang , Sang Ki Ko
- Applicant: SENIC INC.
- Applicant Address: KR Cheonan-si
- Assignee: SENIC INC.
- Current Assignee: SENIC INC.
- Current Assignee Address: KR Cheonan-si
- Agency: NSIP Law
- Priority: KR 20200122141 2020.09.22
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02 ; H01L21/04 ; H01L29/16 ; H01L29/78 ; C30B29/36
Abstract:
A method of cleaning a wafer comprises: a scrubbing operation comprising treating a target wafer to be cleaned with a brush at a rotation rate of 200 rpm or less to prepare a brush cleaned wafer; and a cleaning operation comprising cleaning the brush cleaned wafer with a cleaning solution to prepare a cleaned bare wafer, wherein the cleaning operation comprises a first cleaning operation and a second cleaning operation sequentially.
Public/Granted literature
- US20220093419A1 METHOD OF CLEANING WAFER AND WAFER WITH REDUCED IMPURITIES Public/Granted day:2022-03-24
Information query
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