Invention Grant
- Patent Title: Manufacturing process of a structured substrate
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Application No.: US17166028Application Date: 2021-02-03
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Publication No.: US11646219B2Publication Date: 2023-05-09
- Inventor: Jean-Pierre Colinge
- Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Applicant Address: FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee Address: FR Paris
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR 01082 2020.02.04
- Main IPC: H01L21/763
- IPC: H01L21/763 ; H01L21/02 ; H01L21/762 ; H01L21/304 ; H01L21/306

Abstract:
A method for manufacturing a structured substrate provided with a trap-rich layer whereon rests a stack consisting of an insulating layer and of a layer of single-crystal material, includes forming an amorphous silicon layer on a front face of a silicon substrate and heat treating intended to convert the amorphous silicon layer into a trap-rich layer made of single-crystal silicon grains. The heat treatment conditions in terms of duration and of temperature are adjusted to limit the grains to a size less than 200 nm. The method also includes overlapping the trap-rich layer with an insulating layer and a layer of single-crystal material.
Public/Granted literature
- US20210242071A1 MANUFACTURING PROCESS OF A STRUCTURED SUBSTRATE Public/Granted day:2021-08-05
Information query
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