- Patent Title: Stealth dicing method including filamentation and apparatus thereof
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Application No.: US16926842Application Date: 2020-07-13
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Publication No.: US11646228B2Publication Date: 2023-05-09
- Inventor: Heping Zeng , Shuai Yuan , Yingsheng Du , Hui Xu , Yuan Nie , Yong Wang , Jin Wang , Jue Yu , Yanying Ma
- Applicant: Chongqing Institute of East China Normal University , East China Normal University , University of Shanghai for Science and Technology
- Applicant Address: CN Chongqing
- Assignee: CHONGQING INSTITUTE OF EAST CHINA NORMAL UNIVERSITY,EAST CHINA NORMAL UNIVERSITY,UNIVERSITY OF SHANGHAI FOR SCIENCE AND TECHNOLOGY
- Current Assignee: CHONGQING INSTITUTE OF EAST CHINA NORMAL UNIVERSITY,EAST CHINA NORMAL UNIVERSITY,UNIVERSITY OF SHANGHAI FOR SCIENCE AND TECHNOLOGY
- Current Assignee Address: CN Chongqing; CN Shanghai; CN Shanghai
- Agency: Hodgson Russ LLP
- Priority: CN 1910857191.6 2019.09.11 CN 1910857217.7 2019.09.11
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/268 ; B23K26/064 ; B23K26/08 ; B23K26/06 ; B23K26/0622 ; B23K26/402 ; B23K26/53 ; B23K26/073 ; B23K103/00
Abstract:
The present disclosure provides a stealth dicing method and apparatus. With the method, the focusing element focuses the laser beam on the surface of material to be diced, and the dynamic-equilibrium plasma channel is formed in the material to be diced by means of self-focusing and defocusing effect of plasma generated by ionizing the material to be diced. The modified layer may be formed in the material to be diced throughout the plasma channel, so as to realize stealth dicing.
Public/Granted literature
- US20210074585A1 STEALTH DICING METHOD AND APPARATUS Public/Granted day:2021-03-11
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