Invention Grant
- Patent Title: Ball interconnect structures for surface mount components
-
Application No.: US15943391Application Date: 2018-04-02
-
Publication No.: US11646253B2Publication Date: 2023-05-09
- Inventor: Tyler Leuten
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP.
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00 ; H05K1/11
Abstract:
Embodiments include a microelectronic package structure having a substrate with one or more substrate pads on a first side of the package substrate. A ball interconnect structure is on the substrate pad, the ball interconnect structure comprising at least 99.0 percent gold. A discrete component having two or more component terminals is on the ball interconnect structure.
Public/Granted literature
- US20190304886A1 BALL INTERCONNECT STRUCTURES FOR SURFACE MOUNT COMPONENTS Public/Granted day:2019-10-03
Information query
IPC分类:
