Invention Grant
- Patent Title: Integrated circuits including multi-layer conducting lines
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Application No.: US17197280Application Date: 2021-03-10
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Publication No.: US11646261B2Publication Date: 2023-05-09
- Inventor: Tae-hyung Kim , Chan-Ho Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20180104019 2018.08.31 KR 20190035178 2019.03.27
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L25/065 ; G11C5/02 ; H01L23/528 ; G02B6/43

Abstract:
An integrated circuit includes a plurality of layers stacked in a first direction, a plurality of unit circuits at least partially overlapping each other in a second direction that is perpendicular to the first direction and configured to operate in parallel with one another, control circuitry configured to generate a control signal to control the plurality of unit circuits, and a multi-layer conducting line configured to transfer the control signal from the control circuitry to the plurality of unit circuits. The multi-layer conducting line may be integrally formed in a wiring layer and a via layer and extends in the second direction. The wiring layer and the via layer may be adjacent to each other.
Public/Granted literature
- US20210202373A1 INTEGRATED CIRCUITS INCLUDING MULTI-LAYER CONDUCTING LINES Public/Granted day:2021-07-01
Information query
IPC分类: