A module (101) is provided with a substrate including a principal surface (1u), a plurality of electronic components (41, 42, and 43) arranged on the principal surface (1u), a sealing resin (3) covering the principal surface (1u), a ground electrode arranged on the principal surface (1u), a conductive layer (6) covering the sealing resin (3), and a magnetic member (5). The conductive layer (6) is electrically connected to the ground electrode by a plurality of connecting conductors (62) arranged so as to penetrate the sealing resin (3), and the magnetic member (5) includes a magnetic member plate-shaped portion arranged so as to cover the sealing resin (3) and a magnetic member wall-shaped portion (52) arranged in a wall shape in the sealing resin (3). The magnetic member wall-shaped portion (52) is longer than each of the connecting conductors (62).