Invention Grant
- Patent Title: Semiconductor devices and methods of manufacturing the same
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Application No.: US16946620Application Date: 2020-06-30
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Publication No.: US11646305B2Publication Date: 2023-05-09
- Inventor: Sungok Lee , Sangdo Park , Jun Seomun , Bonghyun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR 20190122523 2019.10.02 KR 20200007272 2020.01.20
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L27/02

Abstract:
Semiconductor devices may include standard cells arranged in a first direction and a second direction intersecting the first direction. Both the first and second directions may be parallel to an upper surface of the substrate. Each of the standard cells may include semiconductor elements. The semiconductor device may also include filler cells between two standard cells, and each of the filler cells may include a filler active region and a filler contact connected to the filler active region and may extend in the first direction. The semiconductor device may further include a lower wiring pattern electrically connected to at least one of the semiconductor elements and may extend into at least one of the filler cells in the second direction, and the filler contacts may include wiring filler contacts lower than the lower wiring pattern and connected to at least one of the lower wiring pattern.
Public/Granted literature
- US20210104508A1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2021-04-08
Information query
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