Invention Grant
- Patent Title: Semiconductor and circuit structures, and related methods
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Application No.: US17357803Application Date: 2021-06-24
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Publication No.: US11646313B2Publication Date: 2023-05-09
- Inventor: Chang-Fen Hu , Shao-Yu Li , Kuo-Ji Chen , Chih-Peng Lin , Chuei-Tang Wang , Ching-Fang Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT Law
- Agent Anthony King
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L25/065 ; H01L23/538 ; H01L25/00

Abstract:
A circuit structure is provided. The circuit structure may include a first die area including an output gate, a second die area including a circuit and an input gate and a die-to-die interconnect. The input gate may include a transistor. The circuit may be connected between the die-to-die interconnect and a gate region of the transistor. The circuit may include a PMOS transistor and an NMOS transistor. A first source/drain region of the PMOS transistor may be connected to a first source/drain region of the NMOS transistor and the die-to-die interconnect.
Public/Granted literature
- US20220293597A1 SEMICONDUCTOR AND CIRCUIT STRUCTURES, AND RELATED METHODS Public/Granted day:2022-09-15
Information query
IPC分类: