Invention Grant
- Patent Title: Image pickup element, image pickup device, manufacturing device and method
-
Application No.: US17741387Application Date: 2022-05-10
-
Publication No.: US11646339B2Publication Date: 2023-05-09
- Inventor: Yoichi Ootsuka , Atsushi Yamamoto , Kensaku Maeda
- Applicant: Sony Group Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Group Corporation
- Current Assignee: Sony Group Corporation
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP 12122851 2012.05.30 JP 12237371 2012.10.29
- Main IPC: H01L27/146
- IPC: H01L27/146 ; G02B3/00 ; G02B5/20 ; G02B1/11
Abstract:
There is provided an image pickup element including a non-planar layer having a non-planar light incident surface in a light receiving region, and a microlens of an inorganic material which is provided on a side of the light incident surface of the non-planar layer, and collects incident light.
Public/Granted literature
- US20220278156A1 IMAGE PICKUP ELEMENT, IMAGE PICKUP DEVICE, MANUFACTURING DEVICE AND METHOD Public/Granted day:2022-09-01
Information query
IPC分类:
