Invention Grant
- Patent Title: Method for preparing a p-type semiconductor structure, enhancement mode device and method for manufacturing the same
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Application No.: US17151211Application Date: 2021-01-18
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Publication No.: US11646357B2Publication Date: 2023-05-09
- Inventor: Kai Cheng
- Applicant: ENKRIS SEMICONDUCTOR, INC.
- Applicant Address: CN Suzhou
- Assignee: ENKRIS SEMICONDUCTOR, INC.
- Current Assignee: ENKRIS SEMICONDUCTOR, INC.
- Current Assignee Address: CN Suzhou
- Agency: Westbridge IP LLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/324 ; H01L29/778 ; H01L29/43 ; H01L21/02 ; H01L29/205 ; H01L29/06 ; H01L29/20 ; H01L29/207

Abstract:
The present application provides a method for preparing a p-type semiconductor structure, an enhancement mode device and a method for manufacturing the same. The method for preparing a p-type semiconductor structure includes: preparing a p-type semiconductor layer; preparing a protective layer on the p-type semiconductor layer, in which the protective layer is made of AlN or AlGaN; and annealing the p-type semiconductor layer under protection of the protective layer, and at least one of the p-type semiconductor layer and the protective layer is formed by in-situ growth. In this way, the protective layer can protect the p-type semiconductor layer from volatilization and to form high-quality surface morphology in the subsequent high-temperature annealing treatment of the p-type semiconductor layer.
Public/Granted literature
- US20210143264A1 METHOD FOR PREPARING A P-TYPE SEMICONDUCTOR LAYER, ENHANCED DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2021-05-13
Information query
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