Invention Grant
- Patent Title: Laser assisted metallization process for solar cell circuit formation
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Application No.: US16377074Application Date: 2019-04-05
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Publication No.: US11646387B2Publication Date: 2023-05-09
- Inventor: Pei Hsuan Lu , Benjamin I. Hsia , David Aaron Randolph Barkhouse , David C. Okawa , David F. Kavulak , Lewis C. Abra , George G. Correos , Richard Hamilton Sewell , Ryan Reagan , Tamir Lance , Thierry Nguyen
- Applicant: SunPower Corporation
- Applicant Address: US CA San Jose
- Assignee: Maxeon Solar Pte. Ltd.
- Current Assignee: Maxeon Solar Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L31/05
- IPC: H01L31/05 ; H01L31/0224 ; H02S40/34 ; H01L31/18 ; H01L31/068

Abstract:
A method of fabricating solar cell, solar laminate and/or solar module string is provided. The method may include: locating a metal foil over a plurality of semiconductor substrates; exposing the metal foil to laser beam over selected portions of the plurality of semiconductor substrates, wherein exposing the metal foil to the laser beam forms a plurality conductive contact structures having of locally deposited metal portion electrically connecting the metal foil to the semiconductor substrates at the selected portions; and selectively removing portions of the metal foil, wherein remaining portions of the metal foil extend between at least two of the plurality of semiconductor substrates.
Public/Granted literature
- US20190312166A1 LASER ASSISTED METALLIZATION PROCESS FOR SOLAR CELL CIRCUIT FORMATION Public/Granted day:2019-10-10
Information query
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