Invention Grant
- Patent Title: Busbar module
-
Application No.: US15930982Application Date: 2020-05-13
-
Publication No.: US11646458B2Publication Date: 2023-05-09
- Inventor: Tomoji Yasuda , Yoshiaki Ichikawa , Tatsuya Oga
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Banner & Witcoff, Ltd.
- Priority: JP 2019112234 2019.06.17
- Main IPC: H01M10/48
- IPC: H01M10/48 ; H01M10/42 ; H05K1/02 ; H01M50/507 ; H01M50/524 ; H01M50/522 ; H01M50/209

Abstract:
A busbar module includes: a circuit body having a flexible circuit board; busbars; and a holder. The circuit body has: conductor layers and protective layers to form a multiple-layered structure of wiring patterns; a band-shaped main strip to be located to extend in a stacking direction of cells; and a band-shaped branch strip branched from the main strip. The branch strip has: a bent portion extending in the stacking direction and having a bent shape around an axis crossing the stacking direction; and a connection portion disposed closer to an end of the branch strip than the bent portion and connected to the corresponding busbar. The bent portion has a thin-layer portion having a shape formed by removing, from the flexible circuit board, a part of the protective layers corresponding to a part of the conductor layers without being used as the wiring pattern in the branch strip.
Information query