Invention Grant
- Patent Title: Connection assembly for an information handling system
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Application No.: US17451708Application Date: 2021-10-21
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Publication No.: US11646515B1Publication Date: 2023-05-09
- Inventor: Bhyrav M. Mutnury , Mark A. Smith , Sanjiv C. Sinha , Sandor Farkas
- Applicant: Dell Products L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: McDermott Will & Emery LLP
- Main IPC: H01R12/58
- IPC: H01R12/58 ; H01R12/53 ; H01R12/73

Abstract:
A connection assembly, including: a first connector having a first end and a second end, and a first surface extending between the first end and the second end, the first connector including press fit pins extending away from the first surface, each of the press fit pins including: a rod portion; a connecting portion having a first shape; a second connector having a first end and a second end, including: a dielectric carrier having a first surface extending between the first end and the second end of the second connector, receptacles positioned within the first surface of the dielectric carrier, each of the receptacles including: a cylindrical region, a tapered region having a second shape that corresponds to the first shape of the connection portion, wherein, when the first connector is coupled to the second connector, the press fit pins are positioned within respective receptacles of the receptacles.
Public/Granted literature
- US20230128773A1 CONNECTION ASSEMBLY FOR AN INFORMATION HANDLING SYSTEM Public/Granted day:2023-04-27
Information query
IPC分类: