An interface connector disposed at a circuit board, comprising a housing, a first heat dissipating member, and a second heat dissipating member. A first accommodating space is disposed in the housing. The first accommodating space accommodates a first mating connector. One side of the housing is disposed at the circuit board. The first heat dissipating member is disposed at the outside of the housing. The first heat dissipating member passes through the housing and extends into the first accommodating space to be connected with the first mating connector. The second heat dissipating member is disposed at the circuit board. The second heat dissipating member passes through the circuit board and the housing and extends into the housing. The heat from the first mating connector is dissipated through the components of the first heat dissipating member. Thus the heat dissipation issue of mating connector having high power chips can be solved.