Invention Grant
- Patent Title: Electronic apparatus, imaging apparatus, and mobile body
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Application No.: US17269616Application Date: 2019-08-23
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Publication No.: US11647265B2Publication Date: 2023-05-09
- Inventor: Hiroyuki Abe , Takahiro Okada
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Studebaker & Brackett PC
- Priority: JP 2018159392 2018.08.28
- International Application: PCT/JP2019/033158 2019.08.23
- International Announcement: WO2020/045307A 2020.03.05
- Date entered country: 2021-02-19
- Main IPC: H04N5/225
- IPC: H04N5/225 ; B60R11/04 ; G03B17/12 ; H05K1/02 ; H05K1/18 ; B60R11/00
Abstract:
An electronic apparatus includes a substrate, a housing, and an adhesive. The housing has opposing surfaces respectively opposing side surfaces of a first diagonal portion and second diagonal portion serving as a pair of diagonal portions of the substrate and encloses the substrate. The adhesive is positioned between the side surfaces of the first diagonal portion and the second diagonal portion of the substrate and the opposing surfaces of the housing.
Public/Granted literature
- US20210344817A1 ELECTRONIC APPARATUS, IMAGING APPARATUS, AND MOBILE BODY Public/Granted day:2021-11-04
Information query
