Invention Grant
- Patent Title: TWS earphone communication method and system for TWS earphones
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Application No.: US17355124Application Date: 2021-06-22
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Publication No.: US11647322B2Publication Date: 2023-05-09
- Inventor: Shuai Li , Maogang Li
- Applicant: VeriSilicon Microelectronics (Shanghai) Co., Ltd. , VeriSilicon Holdings Co., Ltd.
- Applicant Address: CN Shanghai
- Assignee: VeriSilicon Microelectronics (Shanghai) Co., Ltd.,VeriSilicon Holdings Co., Ltd.
- Current Assignee: VeriSilicon Microelectronics (Shanghai) Co., Ltd.,VeriSilicon Holdings Co., Ltd.
- Current Assignee Address: CN Pudong New Area; KY Grand Cayman
- Priority: CN 2010573192.0 2020.06.22
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04W76/14 ; H04L1/18

Abstract:
The present disclosure provides a TWS earphone communication method and system, and TWS earphones. The method includes: when an audio source sends a data packet and a main earphone correctly receives the data packet, the main earphone sends acknowledgment information in an acknowledgment information slot; when the data packet is incorrectly received by the main earphone, no information is sent in the acknowledgment information slot; and when the data packet is received correctly by a secondary earphone, the secondary earphone does not send any information in the acknowledgment information slot. When the data packet is not received correctly by the secondary earphone, it sends interference information in the acknowledgment information slot.
Public/Granted literature
- US20210400374A1 TWS EARPHONE COMMUNICATION METHOD AND SYSTEM FOR TWS EARPHONES Public/Granted day:2021-12-23
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