Invention Grant
- Patent Title: Microphone unit
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Application No.: US17585044Application Date: 2022-01-26
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Publication No.: US11647329B2Publication Date: 2023-05-09
- Inventor: Tsutomu Matsushita , Hiroyuki Harano , Ryuji Awamura , Kensuke Nakanishi
- Applicant: HOSIDEN CORPORATION
- Applicant Address: JP Osaka
- Assignee: HOSIDEN CORPORATION
- Current Assignee: HOSIDEN CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP 2021015695 2021.02.03
- Main IPC: H04R1/44
- IPC: H04R1/44 ; H04R1/08

Abstract:
A microphone unit including a tubular case having an opened top and an opened bottom, a waterproof film made of metal that has a thickness of 0.01 mm or more and 0.05 mm or less, a hardness of 100 HV or more, a proof stress of 70 N/mm2 or more, and a tensile strength of 350 N/mm2 or more, the waterproof film being fixed to the bottom of the case so as to block an opening part of the bottom of the case, a substrate arranged in the case, a microphone mounted on the substrate, and a sealing member that seals an opening part of the top of the case.
Public/Granted literature
- US20220248132A1 MICROPHONE UNIT Public/Granted day:2022-08-04
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