Invention Grant
- Patent Title: Chip-on-chip power devices embedded in PCB and cooling systems incorporating the same
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Application No.: US17307405Application Date: 2021-05-04
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Publication No.: US11647579B2Publication Date: 2023-05-09
- Inventor: Feng Zhou , Hiroshi Ukegawa , Ercan Mehmet Dede
- Applicant: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
- Applicant Address: US TX Plano
- Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
- Current Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
- Current Assignee Address: US TX Plano
- Agency: Dinsmore & Shohl LLP
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H05K7/20
Abstract:
Printed circuit board (PCB) substrates include at least one pre-preg layer interposed between one or more electrically conductive layers, power device stacks, each having a power device embedded within the PCB substrate in a vertical stack configuration, and a flat heat pipe positioned between the power device stacks within the at least one pre-preg layer, one surface of the flat heat pipe directly bonded to a first one of the power device stacks and an opposite surface of the flat heat pipe thermally coupled to a second one of the power device stacks.
Public/Granted literature
- US20220361315A1 CHIP-ON-CHIP POWER DEVICES EMBEDDED IN PCB AND COOLING SYSTEMS INCORPORATING THE SAME Public/Granted day:2022-11-10
Information query
