Invention Grant
- Patent Title: Fast flow cooling bath for multiprocessor circuit boards
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Application No.: US17084006Application Date: 2020-10-29
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Publication No.: US11647606B2Publication Date: 2023-05-09
- Inventor: Ivan Kirillov
- Applicant: Ivan Kirillov
- Applicant Address: RU Moscow
- Assignee: Ivan Kirillov
- Current Assignee: Ivan Kirillov
- Current Assignee Address: RU Moscow
- Agency: Pillsbury Winthrop Shaw Pittman, LLP
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A system and a method are disclosed for a cooling bath designed to cool a high density of devices within the bath. Coolant is circulated between the cooling bath and external pumps, which use a high flow rate of coolant to cool the high density of devices. The cooling bath includes inlet pipes, distribution pipes, a device chamber, and draining sections. The inlet pipes and distribution pipes are structured such that a mound of coolant may accumulate within the bath, forming a peak near the center of the bath. Coolant flows in a direction from the center of the bath towards draining sections on opposing ends of the bath. Draining sections are structured to receive hot coolant at a relatively slow flow rate and prevent air from being expelled from the cooling bath with the hot coolant.
Public/Granted literature
- US20220022343A1 FAST FLOW COOLING BATH FOR MULTIPROCESSOR CIRCUIT BOARDS Public/Granted day:2022-01-20
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