Invention Grant
- Patent Title: High-density integrated power electronic assembly including double-sided cooling structure
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Application No.: US17164268Application Date: 2021-02-01
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Publication No.: US11647612B2Publication Date: 2023-05-09
- Inventor: Hitoshi Fujioka , Shailesh N. Joshi , Hiroshi Ukegawa
- Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
- Applicant Address: US TX Plano
- Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
- Current Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
- Current Assignee Address: US TX Plano
- Agency: Dinsmore & Shohl LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H02M7/00 ; H01L23/427
Abstract:
An integrated power electronic assembly includes a power electronic device, a cooling assembly offset from and thermally coupled to a second edge of the power electronic device, and a thermal spreader offset from and thermally coupled to a first edge of the power electronic device. The first edge of the power electronic device is opposite the second edge of the power electronic device, and the thermal spreader is thermally coupled to the cooling assembly.
Public/Granted literature
- US20220167524A1 HIGH-DENSITY INTEGRATED POWER ELECTRONIC ASSEMBLY INCLUDING DOUBLE-SIDED COOLING STRUCTURE Public/Granted day:2022-05-26
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