Invention Grant
- Patent Title: Electronic device package and manufacturing method thereof
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Application No.: US17028060Application Date: 2020-09-22
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Publication No.: US11647615B2Publication Date: 2023-05-09
- Inventor: Young Ho Jeon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR 20200081016 2020.07.01
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H01L23/552 ; H01L23/13 ; H05K1/02 ; H01L21/56 ; H05K1/18
Abstract:
An electronic device package is disclosed. The electronic device package includes a board on which an electronic device is mounted, a molded portion formed to cover the electronic device on the board, and a conductive layer disposed on a surface of the molded portion and extended in a trench formed on the board.
Public/Granted literature
- US20220007554A1 ELECTRONIC DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-01-06
Information query
