The present invention provides an electromagnetic wave shielding film that can be made thinner and that has a higher folding endurance. The electromagnetic wave shielding film of the present invention is an electromagnetic wave shielding film including: a conductive adhesive layer containing conductive particles and an adhesive resin composition, wherein in a cut surface of the conductive adhesive layer after heating and pressurizing the electromagnetic wave shielding film at 150° C. and 2 MPa for 30 minutes, the conductive particles have an average aspect ratio of 18 or more, and an area percentage of the adhesive resin composition is 60 to 95% relative to a total area of the cut surface.