Invention Grant
- Patent Title: Electromagnetic wave shielding film
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Application No.: US17781482Application Date: 2020-12-01
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Publication No.: US11647619B2Publication Date: 2023-05-09
- Inventor: Kouji Takami , Masahiro Watanabe , Shigeki Takeshita
- Applicant: Tatsuta Electric Wire & Cable Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Current Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: United IP Counselors, LLC
- Agent Kenneth Fagin
- Priority: JP 2019218526 2019.12.03
- International Application: PCT/JP2020/044658 2020.12.01
- International Announcement: WO2021/112075A 2021.06.10
- Date entered country: 2022-06-01
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
Provided is an electromagnetic wave shielding film capable of easily adhering to an object, excellent in electrical connection stability, and excellent in transparency, shielding performance, and environmental resistance. The electromagnetic wave shielding film of the present invention has a first insulating layer, a transparent metal layer, a second insulating layer, and a conductive adhesive layer laminated in this order, in which a thickness of the second insulating layer is 10 to 500 nm, the conductive adhesive layer contains a binder component and spherical conductive particles, a median size of the spherical conductive particles is 3 to 50 μm, and a content ratio of the spherical conductive particles is 5 to 20 mass % with respect to 100 mass % of the conductive adhesive layer.
Public/Granted literature
- US20230007817A1 Electromagnetic Wave Shielding Film Public/Granted day:2023-01-05
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