Invention Grant
- Patent Title: Apparatuses and methods for controlling structure of bottom electrodes and providing a top-support thereof
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Application No.: US17122706Application Date: 2020-12-15
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Publication No.: US11647624B2Publication Date: 2023-05-09
- Inventor: Akira Kaneko , Keisuke Otsuka
- Applicant: MICRON TECHNOLOGY, INC.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Dorsey & Whitney LLP
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
An apparatus includes: a substrate; a plurality of pillar-shaped bottom electrodes provided over the substrate; and an upper electrode covering side and top surfaces of the pillar-shaped bottom electrodes with an intervening capacitor insulating film therebetween; wherein the pillar-shaped bottom electrodes have at least an upper portion and a lower portion, and the diameter of the upper portion is smaller than the diameter of the lower portion.
Public/Granted literature
Information query
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