Invention Grant
- Patent Title: Cover plate used in electronic device, electronic device, and method of manufacturing cover plate
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Application No.: US17147678Application Date: 2021-01-13
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Publication No.: US11647645B2Publication Date: 2023-05-09
- Inventor: Chun Yan Wu , Lien-Hsin Lee , Shi Yuan Lian , Xian Bin Xu , Ming Qiang Fu , Ming Hsien Ko
- Applicant: TPK Advanced Solutions Inc.
- Applicant Address: CN Fujian
- Assignee: TPK Advanced Solutions Inc.
- Current Assignee: TPK Advanced Solutions Inc.
- Current Assignee Address: CN Fujian
- Agency: Cooper Legal Group, LLC
- Main IPC: G06F3/041
- IPC: G06F3/041 ; H04M1/02
Abstract:
A cover plate used in an electronic device includes a glass layer and at least one transparent covering layer. The glass layer has a first surface and a second surface. The transparent covering layer contacts and is disposed on at least one of the first surface and the second surface, and the transparent covering layer is laminated with the glass layer. The cover plate has a Young's modulus of about 10 GPa to about 200 GPa.
Public/Granted literature
- US20220223816A1 COVER PLATE USED IN ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING COVER PLATE Public/Granted day:2022-07-14
Information query
