Invention Grant
- Patent Title: Method for encapsulating openings in display area, encapsulation structure of openings in display area and display panel
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Application No.: US16765270Application Date: 2019-12-19
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Publication No.: US11647646B2Publication Date: 2023-05-09
- Inventor: Yufei Ji , Dong Yang , Jiahao Xu , Jianglin Wang , Dongliang Lu , Liang Song , Hao Cheng
- Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Chengdu
- Assignee: Chengdu BOE Optoelectronics Technology Co., Ltd.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: Chengdu BOE Optoelectronics Technology Co., Ltd.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Sichuan; CN Beijing
- Agency: Perilla Knox & Hildebrandt LLP
- Agent Kenneth A. Knox
- Priority: CN 1910015728.4 2019.01.08
- International Application: PCT/CN2019/126611 2019.12.19
- International Announcement: WO2020/143421A 2020.07.16
- Date entered country: 2020-05-19
- Main IPC: H01L51/52
- IPC: H01L51/52

Abstract:
A method for encapsulating openings in a display area includes: forming an intermediate layer having an isolation hole and an assembly via on a substrate, the isolation hole dividing the intermediate layer into separate display portion and isolation portion and the assembly via being spaced apart from the isolation hole by the isolation portion; forming a groove on a side of the isolation portion facing the display portion and/or on a side of the isolation portion away from the display portion; forming a light emitting layer including a first light emitting portion, a second light emitting portion, a third light emitting portion, and a fourth light emitting portion, wherein the third light emitting portion is separate from at least one of the second light emitting portion and the fourth light emitting portion; and forming an encapsulation layer that covers the light emitting layer and the isolation portion, and is filled in a groove.
Public/Granted literature
Information query
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