Invention Grant
- Patent Title: Plasticization device, three-dimensional shaping device, and injection molding device
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Application No.: US16943560Application Date: 2020-07-30
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Publication No.: US11648719B2Publication Date: 2023-05-16
- Inventor: Seiichiro Yamashita
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP 2019142062 2019.08.01
- Main IPC: B29C45/50
- IPC: B29C45/50 ; B29C45/60 ; B29C45/62 ; B29C45/20 ; B29C45/74 ; B29C45/72 ; B29C64/209

Abstract:
A plasticization device includes: a cylinder having a supply port through which a material is supplied; a spiral screw configured to rotate inside the cylinder; a nozzle configured to discharge the material plasticized inside the cylinder; a heating unit provided between the supply port in the cylinder and the nozzle; a screw drive unit including a motor configured to rotate the screw; and a case configured to accommodate at least a part of the screw drive unit and having a first refrigerant flow path.
Public/Granted literature
- US20210031423A1 PLASTICIZATION DEVICE, THREE-DIMENSIONAL SHAPING DEVICE, AND INJECTION MOLDING DEVICE Public/Granted day:2021-02-04
Information query
IPC分类: