Invention Grant
- Patent Title: Sealing method
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Application No.: US16756541Application Date: 2017-10-17
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Publication No.: US11648765B2Publication Date: 2023-05-16
- Inventor: Yutaka Nakamura
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Conley Rose, P.C.
- International Application: PCT/CN2017/106590 2017.10.17
- International Announcement: WO2019/075645A 2019.04.25
- Date entered country: 2020-04-16
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B32B37/12 ; B32B7/14 ; B32B37/00 ; B32B38/00 ; G06F3/041 ; B29C65/14 ; B29C65/48 ; B29C65/02 ; B29C65/40
Abstract:
A sealing method includes dispensing an adhesive on an edge surface of a first part, performing a first activation for hardening the adhesive to a predetermined hardness, performing a second activation for triggering appearance of adhesion strength of the adhesive, assembling the first part and a second part, and pressing the first part and the second part against each other.
Public/Granted literature
- US20200290336A1 Sealing Method Public/Granted day:2020-09-17
Information query
