Invention Grant
- Patent Title: Enhancing bond strength of medical devices
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Application No.: US17012927Application Date: 2020-09-04
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Publication No.: US11649341B2Publication Date: 2023-05-16
- Inventor: Jianbin Zhang , Theresa Hermel-Davidock , Edward Bryan Coughlin , Tea Datashvili
- Applicant: Becton, Dickinson and Company
- Applicant Address: US NJ Franklin Lakes
- Assignee: Becton, Dickinson and Company
- Current Assignee: Becton, Dickinson and Company
- Current Assignee Address: US NJ Franklin Lakes
- Agency: Servilla Whitney LLC
- Main IPC: C08L23/06
- IPC: C08L23/06 ; A61L29/04 ; F16L13/007

Abstract:
Components of medical devices include polyethylene-poly(ethylene oxide) amphiphilic graft copolymers (PE-g-PEO) in their base polymer formulations. The base polymeric formulations comprise at least a polymer or co-polymer of ethylene. These components are suitable for solvent-bonding with other components and enhance bond strength of the medical devices.
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