Invention Grant
- Patent Title: Adhesion method, adhesion-structure, and adhesion kit
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Application No.: US17474253Application Date: 2021-09-14
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Publication No.: US11649379B2Publication Date: 2023-05-16
- Inventor: Akiko Yoshida , Kenichi Okada , Koji Akazawa
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki
- Agency: Hauptman Ham, LLP
- Priority: JP 2015219748 2015.11.09
- The original application number of the division: US15773586
- Main IPC: C09J5/04
- IPC: C09J5/04 ; C09J163/00 ; C09J7/30 ; C09J7/10 ; C09J7/40 ; C09J11/06

Abstract:
An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.
Public/Granted literature
- US20210403759A1 ADHESION METHOD, ADHESION-STRUCTURE, AND ADHESION KIT Public/Granted day:2021-12-30
Information query
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