Invention Grant
- Patent Title: Adhesive tape
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Application No.: US16975525Application Date: 2019-02-26
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Publication No.: US11649381B2Publication Date: 2023-05-16
- Inventor: Daisuke Watanabe , Takamine Sugiura
- Applicant: DIC Corporation
- Applicant Address: JP Tokyo
- Assignee: DIC CORPORATION
- Current Assignee: DIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: WHDA, LLP
- Priority: JP 2018036500 2018.03.01
- International Application: PCT/JP2019/007214 2019.02.26
- International Announcement: WO2019/167922A 2019.09.06
- Date entered country: 2020-08-25
- Main IPC: C09J7/38
- IPC: C09J7/38 ; C09J11/04

Abstract:
An object of the present invention is to provide an adhesive tape that has high conformability and high adhesion to an adherend, particularly, to a hard adherend and that has high removability such that the adhesive tape, when peeled off, can be easily peeled off if it is stretched not only in the horizontal direction of the adhesive tape but also at an angle, without the need to embrittle the adhesive tape, for example, by heating or by using an organic solvent and without leaving an adhesive on the adherend. The present invention relates to an adhesive tape including an adhesive layer containing a filler. The adhesive tape has a thickness of more than 150 μm and less than 1,500 μm, an elongation at break of 600% to 3,000%, and a tensile strength at break of 2.5 to 80.0 MPa.
Public/Granted literature
- US20210032506A1 ADHESIVE TAPE Public/Granted day:2021-02-04
Information query
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