Invention Grant
- Patent Title: Flow pipe
-
Application No.: US17375141Application Date: 2021-07-14
-
Publication No.: US11649918B2Publication Date: 2023-05-16
- Inventor: Kenichi Ryugo , Toshiyuki Saito , Motoo Nakai , Yoshiaki Ando
- Applicant: JTEKT CORPORATION
- Applicant Address: JP Osaka
- Assignee: JTEKT CORPORATION
- Current Assignee: JTEKT CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP 2020129084 2020.07.30
- Main IPC: F16L9/14
- IPC: F16L9/14 ; F16L59/147 ; F16L59/02

Abstract:
There is provided a flow pipe including: a pipe body including a side wall having an opening portion; and a heat insulator arranged at an inner peripheral side of the pipe body and having a flow path through which a fluid flows. The heat insulator has an outer peripheral surface facing with the side wall, and the outer peripheral surface has a flow path structure configured to form a flow path that guides a water droplet generated between the heat insulator and the pipe body to the opening portion.
Public/Granted literature
- US20220034443A1 FLOW PIPE Public/Granted day:2022-02-03
Information query