Invention Grant
- Patent Title: Light emitting device with light emitting members on printed circuit board substrate
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Application No.: US17077302Application Date: 2020-10-22
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Publication No.: US11650458B2Publication Date: 2023-05-16
- Inventor: Dongsoo Lee , Seogho Lim , Changho Shin , Jongpil Won , Sangsu Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR 20200055376 2020.05.08
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H01L33/60 ; G02F1/13357 ; H05K1/02 ; H05K1/18 ; G02F1/1335
Abstract:
A light emitting device includes a printed circuit board (PCB) substrate, a first ink layer covering the PCB substrate, the first ink layer having a first refractive index, light emitters on the first ink layer, and a second ink layer on the first ink layer and spaced apart from the light emitters, the second ink layer having a second refractive index different from the first refractive index.
Public/Granted literature
- US20210351165A1 LIGHT EMITTING DEVICE Public/Granted day:2021-11-11
Information query
IPC分类:
