Invention Grant
- Patent Title: Hard mask-forming composition and method for manufacturing electronic component
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Application No.: US16515612Application Date: 2019-07-18
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Publication No.: US11650503B2Publication Date: 2023-05-16
- Inventor: Junichi Tsuchiya , Keiichi Ibata
- Applicant: TOKYO OHKA KOGYO CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JP 2018146032 2018.08.02
- Main IPC: G03F7/09
- IPC: G03F7/09 ; C08G8/24 ; C08F12/24 ; C09D165/00 ; C09D161/06 ; C09D125/08 ; C09D125/14 ; H01L21/033 ; H01L21/311 ; C08G61/12 ; G03F7/16
Abstract:
A hard mask-forming composition which forms a hard mask used in lithography, including: a resin containing an aromatic ring and a polar group; and a compound containing at least one of an oxazine ring fused to an aromatic ring, and a fluorene ring.
Public/Granted literature
- US20200041904A1 HARD MASK-FORMING COMPOSITION AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT Public/Granted day:2020-02-06
Information query
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