Invention Grant
- Patent Title: Machine learning device and thermal displacement compensation device
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Application No.: US15923534Application Date: 2018-03-16
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Publication No.: US11650565B2Publication Date: 2023-05-16
- Inventor: Mitsunori Watanabe
- Applicant: FANUC CORPORATION
- Applicant Address: JP Yamanashi
- Assignee: FANUC CORPORATION
- Current Assignee: FANUC CORPORATION
- Current Assignee Address: JP Yamanashi
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP 2017054266 2017.03.21
- Main IPC: G05B19/404
- IPC: G05B19/404 ; G01K3/00 ; G01K13/00 ; G01N25/16

Abstract:
A machine learning device includes: a measured data acquisition unit that acquires a measured data group; a thermal displacement acquisition unit that acquires a thermal displacement actual measured value about a machine element; a storage unit that uses the measured data group acquired by the measured data acquisition unit as input data, uses the thermal displacement actual measured value about the machine element acquired by the thermal displacement acquisition unit as a label, and stores the input data and the label in association with each other as teaching data; and a calculation formula learning unit that performs machine learning based on the measured data group and the thermal displacement actual measured value about the machine element, thereby setting a thermal displacement estimation calculation formula used for calculating the thermal displacement of the machine element based on the measured data group.
Public/Granted literature
- US20180275629A1 MACHINE LEARNING DEVICE AND THERMAL DISPLACEMENT COMPENSATION DEVICE Public/Granted day:2018-09-27
Information query
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