Invention Grant
- Patent Title: Fingerprint identification panel, fingerprint identification method and fingerprint identification device
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Application No.: US16646434Application Date: 2019-08-09
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Publication No.: US11651615B2Publication Date: 2023-05-16
- Inventor: Lei Wang , Haisheng Wang , Yingming Liu , Xiaoliang Ding , Lijun Zhao , Yuzhen Guo , Xiaoquan Hai
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Nath, Goldberg & Meyer
- Agent Joshua B. Goldberg
- Priority: CN 1810909642.1 2018.08.10
- International Application: PCT/CN2019/100035 2019.08.09
- International Announcement: WO2020/030130A 2020.02.13
- Date entered country: 2020-03-11
- Main IPC: G06V40/13
- IPC: G06V40/13 ; H01L27/32 ; H01L51/52 ; H01L51/56 ; H01L27/146

Abstract:
The disclosure provides a fingerprint identification panel. The fingerprint identification panel includes an encapsulation layer, a light emitting element, a light sensing element and a dielectric layer. The light emitting element and the light sensing element are on a same side of the encapsulation layer, and the encapsulation layer is configured to enable light emitted from the light emitting element to be totally reflected in the encapsulation layer; the dielectric layer is between the encapsulation layer and the light sensing element and in direct contact with the encapsulation layer, and is configured to enable the light totally reflected by the encapsulation layer to be received by the light sensing element after passing through the dielectric layer, and a refractive index of the dielectric layer is smaller than that of the encapsulation layer.
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