Invention Grant
- Patent Title: Magnetic core inductors
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Application No.: US16637006Application Date: 2017-09-28
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Publication No.: US11651885B2Publication Date: 2023-05-16
- Inventor: Junnan Zhao , Ying Wang , Cheng Xu , Kyu Oh Lee , Sheng Li , Yikang Deng
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Akona IP PC
- International Application: PCT/US2017/053859 2017.09.28
- International Announcement: WO2019/066832A 2019.04.04
- Date entered country: 2020-02-06
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F27/255

Abstract:
Described herein are magnetic core inductors (MCI) and methods for manufacturing magnetic core inductors. A first embodiment of the MCI can be a snake-configuration MCI. The snake-configuration MCI can be formed by creating an opening in a base material, such as copper, and providing a nonconductive magnetic material in the opening. The inductor can be further formed by forming plated through holes into the core material. The conductive elements for the inductor can be formed in the plated through holes. The nonconductive magnetic material surrounds each conductive element and plated through hole. In embodiments, a layered coil inductor can be formed by drilling a laminate to form a cavity through the laminate within the metal rings of the layered coil inductor. The nonconductive magnetic material can be provided in the cavity.
Public/Granted literature
- US20200168384A1 MAGNETIC CORE INDUCTORS Public/Granted day:2020-05-28
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |