Invention Grant
- Patent Title: Multilayer coil component
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Application No.: US16721078Application Date: 2019-12-19
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Publication No.: US11651886B2Publication Date: 2023-05-16
- Inventor: Youichi Kazuta , Kazuya Tobita , Yuto Shiga , Noriaki Hamachi
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP 2018238661 2018.12.20
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F27/32 ; H01F27/29

Abstract:
A multilayer coil component 1 includes an element 2 having a plurality of stacked insulator layers 6 and a coil 8 disposed in the element 2. The coil 8 has a plurality of coil conductors and a connection conductor interconnecting one of the coil conductors and another of the coil conductors. A plurality of the connection conductors are spaced apart only in a direction intersecting with an extension direction of the coil conductors at a position of the connection by the connection conductor.
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |