Invention Grant
- Patent Title: Recognition method of kerf
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Application No.: US17004463Application Date: 2020-08-27
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Publication No.: US11651997B2Publication Date: 2023-05-16
- Inventor: Satoshi Miyata
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: JP 2019159906 2019.09.02
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/68 ; H01L21/683

Abstract:
A recognition method of a kerf includes a bonding step of bonding a workpiece to a dicing tape greater in size than the workpiece, a pre-machining imaging step of imaging an optimal region of the dicing tape where the workpiece is not bonded, a kerf forming step of forming a kerf in the optimal region by a cutting machine, a post-machining imaging step of imaging the optimal region with the kerf formed therein, and a recognition step of comparing intensities of light received at each two corresponding pixels in respective images of the optimal region as acquired by the pre-machining imaging step and the post-machining imaging step, subtracting the each two pixels where intensities of received light are the same, and recognizing as the kerf a region formed by the remaining pixels.
Public/Granted literature
- US20210066129A1 RECOGNITION METHOD OF KERF Public/Granted day:2021-03-04
Information query
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