Provided herein are semiconductor packages with improved clamps. In some embodiments, a semiconductor package may include a housing having a wall extending from a main body, and a set of support walls extending from the wall. The semiconductor package may further include a clamp extending between the set of support walls, the clamp having a first planar section coupled to a first support wall of the set of support walls, a second planar section coupled to a second support wall of the set of support walls, and a third planar section between the first and second planar sections. The third planar section may include an opening operable to receive a fastener, and a plurality of stress relief openings.