A heat dissipation structure includes a heat dissipation portion and a heat storage portion. The heat dissipation portion has the heat receiving surface including the contact surface in contact with the semiconductor generating the heat, and dissipates the heat of the semiconductor in contact with the contact surface. The heat storage portion is arranged to sandwich the semiconductor. The heat storage portion has, for example, the heat storage opening portion in which the semiconductor is positioned, and surrounds the semiconductor. The heat storage portion is provided to he in contact with the heat receiving surface, and stores the heat of the semiconductor conducted through the heat dissipation portion.