Invention Grant
- Patent Title: Power semiconductor device and method
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Application No.: US16944325Application Date: 2020-07-31
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Publication No.: US11652022B2Publication Date: 2023-05-16
- Inventor: Josef Schaetz , Dethard Peters , Stephan Pindl , Hans-Joachim Schulze
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE 2019120692.8 2019.07.31
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L29/423 ; H01L29/51 ; H01L29/06 ; H01L29/40 ; H01L29/16 ; H01L29/78 ; H01L23/367 ; H01L29/66 ; H01L29/739

Abstract:
A power semiconductor device includes: a semiconductor body having a front side and a backside and configured to conduct a load current between the front side and the backside; and a plurality of control cells configured to control the load current. Each control cell is at least partially included in the semiconductor body at the front side and includes a gate electrode that is electrically insulated from the semiconductor body by a gate insulation layer. The gate insulation layer is or includes a first boron nitride layer.
Public/Granted literature
- US20210035882A1 Power Semiconductor Device and Method Public/Granted day:2021-02-04
Information query
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