Invention Grant
- Patent Title: Method for manufacturing semiconductor package structure
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Application No.: US17233245Application Date: 2021-04-16
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Publication No.: US11652081B2Publication Date: 2023-05-16
- Inventor: Yi Dao Wang , Tung Yao Lin , Rong He Guo
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A method for manufacturing a semiconductor package structure is provided. The method includes: (a) providing a semiconductor structure including a first device and a second device; (b) irradiating the first device by a first energy-beam with a first irradiation area; and (c) irradiating the first device and the second device by a second energy-beam with a second irradiation area greater than the first irradiation area of the first energy-beam.
Public/Granted literature
- US20220336406A1 METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE Public/Granted day:2022-10-20
Information query
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