Invention Grant
- Patent Title: Imaging element, method of manufacturing imaging element, imaging device, and method of manufacturing imaging device
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Application No.: US17090009Application Date: 2020-11-05
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Publication No.: US11652122B2Publication Date: 2023-05-16
- Inventor: Tomohiro Yamazaki , Yasushi Maruyama
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross PC
- Priority: JP 15202659 2015.10.14
- The original application number of the division: US15766587
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
There is provided a method of manufacturing an imaging device including a plurality of imaging elements in an imaging area, where each imaging element includes a photoelectric conversion unit in a substrate and a wire grid polarizer arranged at a light-incident side of the photoelectric conversion unit. The method generally includes forming the wire grid polarizer that includes a plurality of stacked strip-shaped portions, where each of the plurality of stacked strip-shaped portions includes a portion of a light-reflecting layer and a portion of a light-absorbing layer. The light-reflecting layer may include a first electrical conducting material that is electrically connected to at least one of the substrate or the photoelectric conversion unit. The light-absorbing layer may include a second electrical conducting material, where at least a portion of the light-absorbing layer is in contact with the light-reflecting layer.
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Information query
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